Addressing Challenges of E-Commerce Packaging

Mon. October 15| 1:00 PM - 1:30 PM | Booth N-4560

As e-commerce sales continue to grow worldwide, traditional product packaging is exposed to an increased number of supply chain touchpoints.  This leads to new challenges including:  product damage, the total package cost, and environmental impact.  To address these issues, the packaging value chain may need to assess the durability of traditional packaging and take a holistic approach to evaluate new primary, secondary, or tertiary package designs.  This presentation will review the high performance packaging resin platforms and structures that are being developed to unlock new formats that packaging engineers and designers can use as they begin this holistic design revaluation.

Type: PACK EXPO International Innovation Stage

Track: Innovation Stage


Speakers

Dunnill, Holly

Dunnill, Holly

Marketing Director for Food & Specialty Packaging, Dow Packaging & Specialty Plastics

The Dow Chemical Company

Craig, Mandy

Craig, Mandy

Senior Marketing Manager

Rigid Packaging

Guerrieri Jr., Robert

Guerrieri Jr., Robert

Market Development Manager

Protective Packaging


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Exhibitors

Dow Chemical Company